Semiconductor Bonding Tools Downloads
DBT
- Die Attachment, Fluid Dispensing (en)
- Die Attachment, Fluid Dispensing (jp)
- Anti-Stick, Solution for Sticky Die Problems (en)
- Flip Chip Ultra Thin Die (en)
- Micro Dispensing Nozzle (en)
Wedge
- Gold & Aluminium Bonding Wedges, Bonding Spectrum (en)
- OSG7, Large Wire Inline Groove Wedge (en)
- CKVD Large Wire Wedge Inline V Groove Design Series (en)
- V-Groove Wedge (en)
Accessories
Capillary
- Bonding Capillaries, Bonding Evolution (en)
- Bonding Capillaries, Bonding Evolution (jp)
- SU Capillary, Solutions for a Robust Copper Wire Bonding (en)
- AZR, Long Life Material for Cu Bonding (en)
- CR, Leading Choice for Cu Wire Bonding (en)
- SF Capillary , Stitch Bond Solution (en)
- Silver Alloy Wire Bonding Capillary (en)
- PI Capillary, Programmed Intelligence, With Your Solutions in Mind (en)
- SQ Capillary, QFN Package Copper and Gold Wire Bonding (en)
- SI Capillary, Stitch Integrator, Enhanced Stitch Bondability (en)
- DFX Capillary, Small Ball Large Wire Capability (en)
- Infinity, Stretching Your Capillary Life (en)