半导体焊接工具

芯片键合工具

• Die Attachment, Fluid Dispensing (en)
• Die Attachment, Fluid Dispensing (jp)
• Anti-Stick, Solution for Sticky Die Problems (en)
• Flip Chip Ultra Thin Die (en)
• Micro Dispensing Nozzle (en)

楔焊工具

• Gold & Aluminium Bonding Wedges, Bonding Spectrum (en)
• Microloy, Osmium-Carbide Alloy (Flyer en)
• OSG7, Large Wire Inline Groove Wedge (en)
• CKVD Large Wire Wedge Inline V Groove Design Series (en)
• V-Groove Wedge (en)

辅料

• Capillary Unplugging Tool (en)
• EFO Wands Superior Sparking Performance (en)

劈刀

• Bonding Capillaries, Bonding Evolution (en)
• Bonding Capillaries, Bonding Evolution (jp)
• SU Capillary, Solutions for a Robust Copper Wire Bonding (en)
• AZR, Long Life Material for Cu Bonding (en)
• CR, Leading Choice for Cu Wire Bonding (en)
• SF Capillary , Stitch Bond Solution (en)
• Silver Alloy Wire Bonding Capillary (en)
• PI Capillary, Programmed Intelligence, With Your Solutions in Mind (en)
• SQ Capillary, QFN Package Copper and Gold Wire Bonding (en)
• SI Capillary, Stitch Integrator, Enhanced Stitch Bondability (en)
• DFX Capillary, Small Ball Large Wire Capability (en)
• Infinity, Stretching Your Capillary Life (en)