Small Wire (SW) and Ribbon Wire (RW) Wedge Series
Small wire/ribbon wedge tools
Which are available for Au, Al and Cu wires ranging from .0005”-.003”(13 microns - 76 microns) incorporates all the latest technical features in semiconductor wire bonding tool designs and is widely used by every bonder manufacturer in the world.
SW Wedge Series
UT / US series - Universal
The UT/US series incorporates all the common features of a wedge with the cavity guide and square back radius that is widely used by most bonder manufacturer. This tool style is most commonly used for small wire application where fine pitch bonding is not required.
30COB Series – Chip On Board
The 30COB series is a standard 30° feed wedge designed for the common auto wedge bonder used for aluminum wire bonding chip on board application. It follows the features of the UT series wedge with the cavity guide but it comes with the elliptical back radius.
ABT Series - Autobonding
The ABT series incorporates all the common features of a wedge with the cavity guide design, which is widely used for small aluminum wire bonding. It comes with the elliptical back radius which keeps the wire in the center of the tool for better bond placement capability.
FP Series - Fine Pitch
The FP series incorporates the best features of ABT and US series designs and usually comes with a side relief VR feature for fine pitch application.
NT/NS Series - Notch
The NT/NS is a standard V-notch design for small aluminum wire that is common use for conventional manual bonding machines.
M Series - Microwave
The M series is a V-notch tool design with short bond foot for small bonding pads, which is common for microwave devices.
RW Series - Ribbon Wedge
RW Series – Ribbon Wire
The RW series is a bonding tool for small ribbon wire bonding with ribbon sizes ranging from .0020"/50 microns up to .0200"/500 microns.