Wedge Bonding Tools
Wedge Bonding Tools for aluminum, gold and copper wire and ribbon Wedge Bonding including Single Point-TAB tool
Introduction in Wedge Bonding
The oldest and still commonly used method in semiconductor assembly is Wedge-to-Wedge Wire Bonding. SPT was involved in the early development of wedge tool design and presently offers a wide selection depending on the wire size, using Au, Al and Cu Wires ranging from .0005”-.003”(13 microns - 76 microns), and large Au, Al and Cu wires .003”-.020”(76 microns - 500 microns). Tools for ribbon wire and various TAB applications are also available under this product category.
Wedge Materials and Shank Configurations
Tool Material selection for various bonding applications in combination with different Shank Styles specific to bonder manufacturers that will suit their bond head transducer platform.
Small Wire (SW) and Ribbon Wire (RW) Wedge Series
Small wire/ribbon Wedge Tools which are available for Au, Al and Cu wires ranging from .0005”-.003” (13 microns - 76 microns) incorporates all the latest technical features in semiconductor wire bonding tool designs and is widely used by every bonder manufacturer in the world.
Large Wire (LW) Wedge Series
Large Wire Wedge Tool design features a single groove typically in V-shape are available for 3mils/75 microns to 24mils/600 microns Al and Cu wires.