Wedge Bonding Tools

Wedge Bonding Tools for aluminum, gold and copper wire and ribbon Wedge Bonding including Single Point-TAB tool

Introduction in Wedge Bonding

The oldest and still commonly used method in semiconductor assembly is Wedge-to-Wedge Wire Bonding. SPT was involved in the early development of wedge tool design and presently offers a wide selection depending on the wire size, using Au, Al and Cu Wires ranging from .0005”-.003”(13 microns - 76 microns), and large Au, Al and Cu wires .003”-.020”(76 microns - 500 microns). Tools for ribbon wire and various TAB applications are also available under this product category.