SF Capillary

Advanced Stitch Bond Solution For Challenging Packages

Copper Wire Bonding in Advanced Packaging

Such as multiple stack dies with BSOB bonding, roughened leadframes poses challenges in meeting bond reliability and stringent requirements in bonding yields.

SPT’s SF capillary is developed with Swiss precision state-of-the-art surface finishing technology to achieve a new level of 2nd bond performance for challenging substrates or leadframes.


Engineered surface morphology. Superior gripping for challenging packages.

SF Surface Morphology


Robust process window.

SF Bondability Process Window


Surpassed automotive requirements.

Surpassed Automotive requirements SF Bondability Automotive Rquirements

Stable tail termination and elimination stitch peeling

SF Stitch Pull Failure Mode Consistent stitch pull failure mode

Consistent stitch pull failure mode

Do you have additional questions regarding our SF Type?

No worries, we are here to support you. Please send your request by clicking on the button below. Thank you very much.

Ask an Expert

Do you need additional Tools?

No worries, we have a huge download repository that includes any Information that you looking for!

Download Area


QFN SF Capillary


SF Capillary Roughened


SF Capillary LED