Robust Material for Copper Wire Bonding
New CR Capillaries series for copper wire bonding application developed to extend useable tool life and lower cost of ownership. It is made of ultra-fine grain, high density ceramic composite material that can withstand high mechanical stress during wire bonding process.
'X' FINISH - Perfectly Combined with CR Material
- Enhanced coupling between wire and capillary tip surface.
- Proven stability for extended period of wire bonding.
- Increased durability - higher mechanical resistance.