Bonding Capillaries
Bonding Capillaries for standard and ultra-fine pitch thermosonic gold, copper and silver alloy wire bonding
SPT offers a wide range of Bonding Capillaries with designs and features optimized for your bonding needs. From standard bonding packages, such as SOIC, TSOP up to complex bonding applications for low-k, stacked die, multi-tier, Cu wire, ultra fine-pitch bonding and many more. SPT Capillaries support your widest array of bonding applications and challenges.
