SPT is the pioneer and market leader for Semiconductor Bonding Tools for over four decades
SPT’s manufacturing facilities and sales network are strategically located across the globe to be close to our customers.
SPT offers a wide range of semiconductor Bonding Tools from Die Attach to Wire Bonding. This includes Die Attach & Vacuum Pickup Tools, Flip Chip Tools and Semiconductor Wire Bonding Capillaries & Wedges. We offer standard designs as well as custom designs for customer specific packaging requirements and challenges.
Dedicated and highly qualified sales and service engineers and application specialists ensure that customers receive professional service and support at all times from the design phase to starting mass production.
SPT Bonding Capillaries differentiate itself from others, utilizing our own exclusive Ceramic Injection Molding (CIM) technology and our own in-house material formulation and sintering processing technologies. We offer a wide range of semiconductor bonding capillaries for standard and ultra fine pitch thermosonic gold, copper and silver alloy wire bonding.
Wedge Bonding Tools
Wedge Bonding Tools for aluminum, gold and copper wire and ribbon wedge bonding including Single Point-TAB tool.