SQ Capillary

Designed for QFN packages


Higher Productivity & Reliability

  

Improved MTBA

With SQ capillary, there will be lesser assist due to short tail or broken stitch which is inherent with bonding QFN package. Experience more machine uptime!

SQ Capillary MTBA Performance using different CU wire diameter

Higher Capillary Touchdown

SQ capillary coupled with optimized bonding parameters, has proven to deliver an increase in the capillary tool life as lower bond force (BF) is utilized to bond the QFN package.

Proven Reliability

Whether on gold or copper wire, the SQ capillary is designed to enhance the formation of larger & width stitch bond that will effectively increase the stitch pull reading values & longer size copper remains.

Features

  • Improved MTBA- With SQ capillary, there will be lesser assist due to short tail or broken stitch which is inherent with bonding QFN package. Experience more machine uptime!
  • Higher Capillary Touchdown -SQ capillary coupled with optimized bonding parameters, has proven to deliver an increase in the capillary tool life as lower bond force (BF) is utilized to bond the QFN package.
  • Proven Reliability - Whether on gold or copper wire, the SQ capillary is designed to enhance the formation of larger & width stitch bond that will effectively increase the stitch pull reading values & longer size copper remains

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ONEWAY ANALYSIS OF STITCH PULL READING BY SQ CAPILLARY TOOL LIFE


ONEWAY ANALYSIS OF STITCH LENGHT BY CAPILLARY TYPE


ONEWAY ANALYSIS OF STITCH WIDTH BY CAPILLARY TYPE


COMPETITOR


SQ CAPILLARY