Robust Material for Copper Wire Bonding
The demand for durable capillary and low cost of ownership are the key drivers for innovation. Researchers at SPT Switzerland have developed ‘CR’, a new ceramic material that is wear resistant in a high mechanical stress copper wire bonding process. ‘CR’ material represents the latest in SPT’s technology and innovation to cater for a wide-range of wire bonding applications while providing the benefits of longer tool life. ‘CR’ is a fine grain, high density ceramic composite with a proprietary engineered surface finishing for enhanced coupling performance.
CR a New Capillary Material
Enhanced coupling between wire and capillary tip surface
Excellent long term bonding stability
Increased durability - higher mechanical resistance
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