Enhanced Stitch Bond for Gold & Silver Alloy Wire Bonding
Stitch Integrator (SI) capillary has been developed with the objective to improve the bondability of the stitch bonds through better coupling effect between the bonding tool and the wire during bonding. Through extensive studies and optimizations, the SI capillary has been derived and has proven to enhance the stitch bondability in many field application.
Improved stitch integrator with the substrate with better ultrasonic energy transfer.
Enhanced coupling effect between the capillary and the wire with better stitch bondability.
Applicable for 2N Au wire, Ag Alloy wire and poor bondability substrate/lead frame.
Higher MTBA with few machine down time and higher production output.