Advanced Stitch Bond Solution For Challenging Packages
Copper wire bonding in advanced packaging, such as multiple stack dies with BSOB bonding, roughened leadframes poses challenges in meeting bond reliability and stringent requirements in bonding yields. SPT's SF capillary is developed with Swiss precision state-of-the-art surface finishing technology to achieve a new level of 2nd bond performance for challenging substrates or leadframes.
Engineered surface morphology. Superior gripping for challenging packages.
Robust process window.