SF Capillary

Advanced Stitch Bond Solution For Challenging Packages


Copper wire bonding  in advanced packaging, such as multiple stack dies with BSOB bonding, roughened leadframes poses challenges in meeting bond reliability and stringent requirements in bonding yields. SPT's SF capillary is developed with Swiss precision state-of-the-art surface finishing technology to achieve a new level of 2nd bond performance for challenging substrates or leadframes. 


Capability 

Engineered surface morphology. Superior gripping for challenging packages.


Bondability

Robust process window.