Ultra Fine Pitch Bonding
The transition from fine-pitch (FP) to ultra fine pitch (UFP) volume production, and the emergence of stacked-die, CSP and ultra low loop bonding has increased the level of difficulties in wire bonding process. In compliance with these new bonding requirements, a new generation and high performance design, known as the PI (Programmed Intelligence) capillary has been developed.
Superior bonding performance with good repeatability and portability for a broad range of complex bonding applications.
Applicable for FP & UFP bonding, ULL bonding, CSP bonding, low-k bonding & stacked-die bonding.
More responsive to the bonding parameters, producing better bond integrity.