Robust Material for Copper Wire Bonding
New capillary series for copper wire bonding application developed to extend useable tool life and lower cost of ownership. It is made of ultra-fine grain, high density ceramic composite material that can withstand high mechanical stress during wire bonding process.
'X' FINISH - Perfectly Combined with CR Material
- Enhanced coupling between wire and capillary tip surface.
- Proven stability for extended period of wire bonding.
- Increased durability - higher mechanical resistance.