Long Life Material for Copper Wire Bonding
The conversion of gold-to-copper wire has been successfully implemented from simple to complex device-package combinations for leaded (e.g. SOIC, QFP, QFN) and laminates, ranging from low-to-high pin counts. Embracing the economic benefits of using copper wire interconnect to compete in the electronic consumer driven market, the semiconductor assembly companies are constantly searching for methods to reduce the cost of ownership, and one of which is through cost per number of touchdowns from the capillary.
Excellent Fine Grain Material Suitability for Copper Wire Bonding
The introduction of SPT’s new material AZR (specifically for copper bonding application), provides the avenue to extend its useful bonding tool life of at least 2x of Alumina Zirconia (AZ). The table shows the essential physical and mechanical differences between AZR and AZ material.
|Grain size µm||<0.9||<0.9|
|Composition||AI2O3 + ZrO2||AI2O3 + ZrO2 + Cr2O3|
The microstructure in SPT’s AZR material (Fig 1) is made of high purity, fine-grained homogenous Alumina Zirconia with Chromium Oxide totally dissolved in the matrix, a highly dense material with excellent hardness, most suitable for rugged metallization terrain used for copper bonding application.
The AZR mechanical properties are further enhanced using SPT’s proprietary state-of-the-art thermal treatment process to ensure high material strength, by elimination of porosity through a combination of high pressure and exact sintering temperature.