Semiconductor Tools - High Performance Ceramics HPC
SPT stands for the highest Precision and Quality in the Areas:
- Bonding Tools for the Semiconductor Industry
- High Performance Ceramics (HPC) for customized Micro-Precision Parts manufactured using the CIM process (Ceramic Injection Molding)
- Customized High-Precision Parts in Carbide and Steel
We drive for total Customer Satisfaction. We achieve this through three factors:
- Advanced technologies
- Highest product quality
- Tailored to our customer’s designs
We strive on continuous quality improvements.
We achieve this through a committed management and highly-motivated employees.
We offer a wide range of semiconductor bonding tools, from die attach to wire bonding. These include die attach & vacuum pick up tolls, flip chip and semiconductor wire bonding capillaries & wedges. We are your "One Stop Solution Partner".
We are specialized in the development and manufacturing of customized high-precision ceramic parts using the Ceramic Injection Molding (CIM) process.