SEST不锈钢材质Epoxy蘸胶头
SEST and WEST
蘸胶胶头的设计基于芯片尺寸。基本建议：
单针头: 芯片尺寸< 0.30mm
圆形： 芯片尺寸< 0.80mm
矩形： 芯片尺寸>0.60mm <1.10mm
星形: 芯片尺寸>1.00mm <6.00mm
网格形 : 芯片尺寸> 2.50mm
| Denomination | Properties |
| SEST | Stainless Epoxy Stamping Tool |
| WEST | Tungsten Carbide Epoxy Stamping |
| Tool Material | Stainless Steel or WC |
| Size | From 0.080mm up |
| Electr. Resistance | Conductors |
| Temp. Resistance | High Temperature compatible, 450°C |
| Tip Options Std | DAUB, ROUND, RECT, STAR, GRID |
| Tip Options Other | FRAME, SPRING |
