Ultra Precision Solutions for Future Technology


Chip Bonding Tools

Fine Ceramic & Machining Parts

Bonding Capillaries
Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding.

Fine Ceramics Solutions
Fine Ceramic Parts - Producted with Cermic Injection Molding (CIM) TechnologySPT is specialized in developing and manufacturing custom ultra precise ceramic parts with Ceramic Injection Molding (CIM)  technology. See our
Application Examples

Die Bonding Tools
Die Bonding & Dispensing Tools for any die pick and place application.
Fine Machining Parts
Cold Forming Tools, Cutting Blades, Nozzles and Wire Guides made of steel and carbides.
High Speed Milling and Electro-Discharge Machining
 Flip Chip Handling Tools
Flip Chip Handling Tools used for Die and Bump Side pick and place application.
High Tech Materials
R&D of new High Tech Materials for Ceramic Injection Molding (CIM)
Bonding Wedges
Chip Bonding Wedges for Ultrasonic Bonding applicationsWedge Bonding Tools for ultrasonic aluminium or gold wire wedge bonding.
Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing.
Single Point-TAB Bonding Tools
Single Point TAB Bonding Tools
Single Point-TAB Bonding Tools for Disk Drive Application.
Service & Support
SPT is committed to quality and customer care. We offer a wide range of proactive support and services such as consulting, design, analysis, training seminars and benchmarking partnerships. Read more...


10th - 13th April

Visit us at Ceramitec 2018
Hall B6, Booth 534
Messe München

 17th - 19th April 2018

Messe, Stuttgart
Visit us at
Hall H9, Booth 9A39

 17th - 20th April 2018

Moutier, Switzerland
Visit us at
Hall 1.2, Booth A19

 8th - 10th May 2018

MITEC, Level 1
Kuala Lumpur, Malaysia
Hall 2&3, Booth 301

 5th - 7th June 2018

Exhibition Centre
Nuremberg Messezentrum
90471 Nuremberg
Visit us at
Hall 4A Booth 344

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