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Ultra Precision Solutions for Future Technology

Chip Bonding Tools	Fine Ceramic & Machining Parts
Bonding Capillaries Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding.	Fine Ceramics Solutions SPT is specialized in developing and manufacturing custom ultra precise ceramic parts with Ceramic Injection Molding (CIM) technology. See our Application Examples
Die Bonding Tools Die Bonding & Dispensing Tools for any die pick and place application.	Fine Machining Parts Cold Forming Tools, Cutting Blades, Nozzles and Wire Guides made of steel and carbides. High Speed Milling and Electro-Discharge Machining
Flip Chip Handling Tools Flip Chip Handling Tools used for Die and Bump Side pick and place application.	High Tech Materials R&D of new High Tech Materials for Ceramic Injection Molding (CIM)
Bonding Wedges Wedge Bonding Tools for ultrasonic aluminium or gold wire wedge bonding.	Technology Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing.
Single Point-TAB Bonding Tools Single Point-TAB Bonding Tools for Disk Drive Application.	Service & Support SPT is committed to quality and customer care. We offer a wide range of proactive support and services such as consulting, design, analysis, training seminars and benchmarking partnerships. Read more...