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Chip Bonding Tools, Fine Ceramic & Machining Parts

 

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Ultra Precision Solutions for Future Technology


Bonding Capillaries
Chip Bonding Capillaries for Thermosonic Bonding applicationsBonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding. 


Fine Ceramics Solutions
Fine Ceramic Parts - Producted with Cermic Injection Molding (CIM) Technology
SPT is specialized in developing and manufacturing custom ultra precise ceramic parts with Ceramic Injection Molding (CIM)  technology. See our
Application Examples


Bonding Wegdes
Chip Bonding Wedges for Ultrasonic Bonding applicationsWedge Bonding Tools for ultrasonic aluminium or gold wire wedge bonding. 

Fine Machining Parts

Fine Machining Parts - High Precision Parts in Steel or CarbideCold Forming Tools, Cutting Blades, Nozzles and Wire Guides made of steel and carbides.
High Speed Milling and Electro-Discharge Machining

Die Bonding Tools
Die Attachement and Fluid Dispensing Tools for the Semiconductor marketDie Bonding & Dispensing Tools for any die pick and place application.

High Tech Materials
High Tech Materials - Molded and Sintered Ceramic with CIM Techology by SPTR&D of new High Tech Materials for Ceramic Injection Molding (CIM)

Service & SupportSPT - Small Precision Tools - Worldwide Network - Local Presence
SPT is committed to quality and customer care. We offer a wide range of proactive support and services such as consulting, design, analysis, training seminars and benchmarking partnerships. Read more...

Technology
High Speed Cutting Part - Dental Bracket Tool for Die-Sinking EDM Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing.


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14 - 16th February 2012
Exhibition MD&M Minneapolis
Booth 2185
Anaheim Convention Center
Anaheim, CA, USA 


Visit us at Medtec, Stuttgart
  Medtec Stuttgart
13 - 15th March 2012
Booth 6851, Hall 6
Landesmesse Stuttgart
Stuttgart, Germany


20th-22nd March 2012
SPT will be at Semicon China 2012
Booth 4428, Hall E4
Shanghai New International
Expo Center (SNIEC)
Shanghai China


24th-26th April 2012
SPT will be at Semicon Singapore 2012
Booth 602, Exhibition Hall B & C
Level 1, Marina Bay Sands
Singapore
 


25 - 26th April 2012

Booth 227
Boston Convention Center
Boston, MA, USA


Visit us at Ceramitec, München
  Tradeshow Ceramitec
22 - 25th May 2012
Booth 526, Hall B6
Neue Messe München
München, Germany


 
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