Ultra Precision Solutions for Future Technology
Chip Bonding Tools |
Fine Ceramic & Machining Parts |
Bonding Capillaries Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding. |
Fine Ceramics Solutions |
Die Bonding Tools Die Bonding & Dispensing Tools for any die pick and place application. |
Fine Machining Parts Cold Forming Tools, Cutting Blades, Nozzles and Wire Guides made of steel and carbides.High Speed Milling and Electro-Discharge Machining |
Flip Chip Handling Tools Flip Chip Handling Tools used for Die and Bump Side pick and place application. |
High Tech Materials R&D of new High Tech Materials for Ceramic Injection Molding (CIM) |
Bonding Wedges Wedge Bonding Tools for ultrasonic aluminium or gold wire wedge bonding. |
Technology Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing. |
Single Point-TAB Bonding Tools Single Point-TAB Bonding Tools for Disk Drive Application. |
Service & Support SPT is committed to quality and customer care. We offer a wide range of proactive support and services such as consulting, design, analysis, training seminars and benchmarking partnerships. Read more... |
News
20th - 22nd March 2019
Shanghai New International
Expo Centre
Shanghai, China
Hall N3, Booth 3753
Shanghai New International
Expo Centre
Shanghai, China
Hall N3, Booth 3753