New capillary series for copper wire bonding application developed to extend useable tool life and lower cost of ownership. It is made of ultra-fine grain, high density ceramic composite material that can withstand high mechanical stress during wire bonding process.
| Bending Strength
| Average Grain Size
'X' FINISH - Perfectly Combined with CR Material
- Enhanced coupling between wire and capillary tip surface
- Proven stability for extended period of wire bonding
- Increased durability - higher mechanical resistance
How To Order
For more information and trial samples, contact your local SPT sales.
Sie benötigen Adobe Acrobat Reader
um diese Dateien anzuschauen.