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Chip Bonding Tools

 
Bonding Capillaries

Bonding Capillaries

Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
 
Die Bonding Tools

Die Bonding Tools

SPT offers a wide range of Die Attachment , Fluid Dispensing  and Accessories tools specialized for the assembly of semiconductor dice including :

  • Replaceable Tips
  • Pick-Up Tools & Die Collets
  • Epoxy Dispensing & Stamping Tools
 
Wedge Bonding Tools

Wedge Bonding Tools

Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
 
Total Bonding Solutions

Total Bonding Solutions

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
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News


9th-11th February 2010
Exhibition MD&M Minneapolis
Booth 2086
Anaheim Convention Center 
Anaheim, CA, USA 


16th-18th March 2010
SPT is at the Semicon China 2009
Booth 2448
Shanghai New International
Expo Center (SNIEC)
Shanghai, China


23th - 25th March 2010
  Medtec Stuttgart
Hall 6, Booth 1869
Landesmesse Stuttgart
Stuttgart, Germany


21th-22th April 2010

Booth 808
  Boston Exhibition &
Convention Center
Boston, MA, USA