Wedge Bonding Tools
Introduction in Wedge Bonding
The oldest and still commonly used method in semiconductor assembly is wedge-to-wedge wire bonding. SPT was involved in the early development of wedge tool design and presently offers a wide selection depending on the wire size, using Au or Al wire ranging from .0005”-.003”(13µm-76µm), and large Al wire .003”-.020”(76µm-500µm). Tools for ribbon wire and various TAB applications are also available under this product category.
Small Wire Bonding Tools
Series:
- Fine Pitch Bonding Tool (FP)
- Universal Bonding Tool (UT/US)
- Chip-On-Board AutoBonding Tool (UT)
- AutoBonding Tool (ABT)
- Microwave Bonding Tool (M)
Large Wire Bonding Tools
Series:
- No-Hole Inline U-Groove (CK)
- No-Hole Inline V-Groove (CKVD)
- No-Hole Inline V-Groove (LWD6)
- No-Hole Inline V-Groove (OSG7)
- Feed Hole Inline V-Groove (45CK)
- Feed Hole Inline V-Groove (AB16)
- Feed Hole Inline V-Groove (3016/4516)
- Feed Hole Inline V-Groove (30D6/45D6/60D6)
- Feed Hole Inline U/V-Groove (1015A, 2015A/1016A, 2016A)
Ribbon Wire Bonding Tool
Series:
- Ribbon Wire Bonding Tool (RW)
Single Point-TAB Bonding Tools
Series:
- Double Cross Groove (7000/7100)
- Double Cross Protrusion (7500/7600)
- Waffle Foot (7045W/7145W)
Special Bonding Tools
Series:
- Side Wire Bonding Wedge (1008A)
- Insulated Wire Bonding Wedge (XGA)
- PF Needle
Microloy Osmium-Carbide Alloy
SPT aquired the business activities of Microminiature Technology, Inc. and continues to produce wedges bonding tools with Osmium-Carbide alloy.
Check SPT Catalogue for design - and order with Material designation M (Microloy) in place of W, Ti or C
Check SPT Catalogue for design - and order with Material designation M (Microloy) in place of W, Ti or C
Wedge Bonding Tools Catalog
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