Ultra-Fine Pitch Wire Bonding 50um And Below
The continuous miniaturization of packaging footprint having a tight bond pad pitch of integrated circuits (IC) has led to an increase in the demand of ultra-fine pitch wire bonding ceramic capillary with a smaller tip diameter profile. Advancement in the wire bonding technology has aggressively changed the definition of ultra-fine pitch from 60µm some years back, to 50µm BPP and below today.
The transition from fine-pitch to ultra-fine pitch volume production has increased the level of difficulties in the wire bonding process. As the bond pad opening becomes smaller for ultra-fine pitch devices, the challenge is to be able to contain the miniature ball bond into the tiny pad opening on the device.
The innovative approach of utilizing the PI capillary design has shown significant improvement in the ultrasonic response. The PI capillary has shown to be more responsive to the bonding parameter with good bondability, repeatability and portability using a wide range of bonding platform.
To further control the deformed ball size within the bond pad opening, SPT has developed the DFX capillary design specifically targeting to contain the gold squashed out during bonding. Based on bonding test conducted in a variety of wire bonders and packages, the DFX capillary has shown to produce superior ball size control with good ball shear performance.
The combination of the PI-DFX capillary design offers the ultimate design features for ultra-fine pitch gold wire bonding application for 50µm BPP and below.
TECHNICAL APPLICATION DATA:
HOW TO ORDER (pdf)
SPT PART NUMBER RECOMMENDATION (pdf)
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