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Bond Reliability

A wire bond process optimization is essential for bonding process stability. The Process optimization defines a process parameter window for ball and wedge bond quality control.
Ball Bond Reliability

Ball Bond Reliability

The area of the bond pad directly affects the effective ball shear readings taken from the bond units. Considering the fine-pitch & ultra fine-pitch application, one can expect much lower set of ball shear readings for 70um bond pad size as compared with the standard devices greater than 125um. read more...
Stitch Bond Reliability

Stitch Bond Reliability

The wire bond pull testing has been an acceptable method in the semiconductor industry to determine the bond quality in terms of pull strengths typically expressed in grams. read more...
 
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