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Wire Bonding Process Optimization

 
Wire bonding process optimization is normally performed through design of experiment (DOE) to further understand how changes affect the outputs. DOE is normally conducted for any new devices, new capillary design or changes made to the wire or substrate, whereby a new process window need to be defined.
Typical Wire Bond Process Optimization

Typical Wire Bond Process Optimization

A wire bond process optimization is essential for bonding process stability. The process optimization defines a process parameter window for ball and wedge bond quality. read more...

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 27th - 29th June
Shanghai New International
Expo Centre
Shanghai, China
Hall N3, Booth 3753

 
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