Wire Bonding Process Optimization
Wire bonding process optimization is normally performed through design of experiment (DOE) to further understand how changes affect the outputs. DOE is normally conducted for any new devices, new capillary design or changes made to the wire or substrate, whereby a new process window need to be defined.
Typical Wire Bond Process Optimization
A wire bond process optimization is essential for bonding process stability. The process optimization defines a process parameter window for ball and wedge bond quality. read more...
News
8 -10 September 2010
Taipei World Trade Center (TWTC)
Hall 1: 5 Hsinyi Road
Sec. 5, Taipei 110, Taiwan
Visit us at Booth 732
Taipei World Trade Center (TWTC)
Hall 1: 5 Hsinyi Road
Sec. 5, Taipei 110, Taiwan
Visit us at Booth 732
12th-14th October 2010
Booth 748
Minneapolis Convention Center
Minneapolis, MN, USA
19-21th October 2010
New Munich Trade Fair Centre
Munich, Germany
Visit us. Hall B6, Booth 602
New Munich Trade Fair Centre
Munich, Germany
Visit us. Hall B6, Booth 602
10th-11th Nov 2010
San Jose McEnery Convention Center
San Jose, CA, USA
Visit us at Booth 1035
San Jose McEnery Convention Center
San Jose, CA, USA
Visit us at Booth 1035