Introduction

UFP: 30µm BPP	BGA	Copper Wire	SOP

The new generation of advanced electronics packages has driven the development of the wire bonding technology to its full limits. Innovative package miniaturization approaches have been concertedly developed to deal with its physical limitation. The end results is a compact, and lighter device with increased I/O’s. Important factors such as higher reliability and possibly at a lower cost, the need for higher integration, higher speed, higher pin count and more features were all considered in the overall package design. This has posed a great deal of new challenges and innovation in the wire bond interconnect technology to develop a new generation of wire bonders; process development and characterization/optimization of new material; and manufacturing and finishing process of ultra-fine pitch wire bonding capillaries. Presently, the packaging technology has reached the sub-50 micron bond pad pitch(BPP) device level in a production mode.

The face-up  wire bonding method has been the mainstream for bonding bare IC like SOP and QFP lead frames. However, the newer process packaging method has emerged, which utilizes a face down flip chip bonding typically used for some ball grid array (BGA) and chip scale package (CSP) - wire bonded packages.

The conventional wire bonding method of having low loop, and long wire span for high pin count for QFP or BGA package types have been the source of noise and delay in signal processing, which directly affects the speed performance of the device. The low-loop and short wire benefits of CSP wire-bonded package have increased the device capability to handle higher frequencies for processing GHz band signals. To further enhance the processing speed, there is a need to integrate copper wire with low-k and ultra low-k dielectric material.

Small Precision Tools (SPT) has equipped and positioned itself to meet these new packaging technology challenges by providing to customers with robust capillary product using the state-of-the-art Ceramic Injection Molding (CIM), an optimized ceramic material and a nanotechnology finishing process.

SPT capillaries are designed based on a given device/package application type, and are optimized to produce consistent and repeatable wire bonding process. Careful consideration is given to the determination of critical tolerances for various capillary dimensions. Customers are therefore assured of high quality standards and conformity to the specifications. All of these benefits are essential to achieve a wider process window resulting to a robust process.

SPT’s DFX, Programmed Intelligence (PI), Stitch Integrator (SI) and Slimline Bottleneck (SBN) capillary series are popular choices for most of the semiconductor companies manufacturing fine-pitch and ultra-fine pitch devices. The UTF, UTS, UTE, and CSA series are common choices for non-fine pitch application. They are adaptable to any of the commercially available wire bonders in the market- whether using a 60KHz, or >99KHz transducer horn frequency.

SPT positions itself as a progressive high technology manufacturer of ultra-precision parts and continue to remain as a world leader in semiconductor ceramic bonding tools, continuously providing high quality products and excellent services to our valued business partners.