Basics of Ball Bonding Process
Thermosonic wire bonding is an electrical interconnection technique using a combination of pressure, ultrasonic energy and heat to produce a solid-state weld. It is the most common method of establishing electrical contact between integrated circuits and substrates. This is usually achieved by bonding thin gold wire between the components. The resulting connections are called wire bonds. Presently, more than 95% of semiconductor chips are ultrasonically welded using this highly flexible and inexpensive technique.
Gold Ball Wire Bonding Process
Thermosonic tailless ball and stitch bonding is the most widely used assembly technique in the semiconductors to interconnect the internal circuitry of the die in the external world. read more...
Wire Bonding Cycle
The ball bonding process starts off with the wire clamp open and a free air ball at the end of the wire, which is protruding outside the capillary tip. read more...
Ball Bonding Process - Movie
Sample Movie -from the Free Air Ball (FAB) to the final Bonding Cycle
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8 -10 September 2010
Taipei World Trade Center (TWTC)
Hall 1: 5 Hsinyi Road
Sec. 5, Taipei 110, Taiwan
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Taipei World Trade Center (TWTC)
Hall 1: 5 Hsinyi Road
Sec. 5, Taipei 110, Taiwan
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12th-14th October 2010
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Minneapolis Convention Center
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19-21th October 2010
New Munich Trade Fair Centre
Munich, Germany
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New Munich Trade Fair Centre
Munich, Germany
Visit us. Hall B6, Booth 602
10th-11th Nov 2010
San Jose McEnery Convention Center
San Jose, CA, USA
Visit us at Booth 1035
San Jose McEnery Convention Center
San Jose, CA, USA
Visit us at Booth 1035