The capillary used for thermosonic ball bonding has many significant features that can affect the bonding process. A good understanding of such features helps to minimize many of the bond quality issues as well as bonding-related problems.
A wire bond process optimization is essential for bonding process stability. The process optimization defines a process parameter for ball and stitch bond quality.
News
17th - 19th March
Shanghai New International
Expo Centre
Shanghai, China Hall N3, Booth 3733