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Technical Guide for Bonding Capillary

 
Introduction

Introduction

The new generation of advanced electronic packages has driven the development of the wire bonding technology to its full limits …..
Ceramic Injection Molding

Ceramic Injection Molding

Mixing of ceramic powder to ceramic injection molding, sintering and the polishing process for the critical dimensions of the capillary.
Basics of Ball Bonding Process

Basics of Ball Bonding Process

Thermosonic ball & stitch bonding is the most widely used assembly technique to interconnect the internal circuitry of the die to the lead …..
Basic Capillary Design Rules

Basic Capillary Design Rules

The capillary used for thermosonic ball bonding has many significant features that can affect the bonding process. A good understanding of such features helps to minimize many of the bond quality issues as well as bonding-related problems.
Wire Bonding Process Optimization

Wire Bonding Process Optimization

A wire bond process optimization is essential for bonding process stability. The process optimization defines a process parameter for ball and stitch bond quality.

News

14th - 16th March 2017
 
Shanghai New International
Expo Centre (SNIEC)
Shanghai, China

Booth Number 4816


4th - 6th April 2017

Messe, Stuttgart,
Germany
Visit us at
Hall 1 Booth 1D38
 
 


 16th - 18th May 2017

Exhibition Centre 
Nuremberg Messezentrum
90471 Nuremberg 
Germany
Visit us at
Hall 4A Booth 148
 


20th - 23rd June 2017
Palexpo Geneva
Switzerland
Visit us at
Booth M98 


 
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