Standard/Non-Fine Pitch Bonding Capillary
While the main stream of wire bonding development has been focused on fine-pitch and ultra-fine pitch bonding, the demand for non-fine pitch capillaries has see little changes over the past few years. These capillaries are normally used for bonding SOT, SOP, PDIP devices with wire diameter ranging from 18 to 50um. Since the bonded balls are very far apart, a non-bottleneck capillary design is sufficient to achieve the desired bonding responses.
In the past, a wide range of capillary design has been recommended for different packages. Today, SPT re-optimized and consolidated the broad range of different capillary designs into 2 main groups. UT and CSA Series.
Devices bonded with non-fine pitch capillary