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Ball Stitch On Ball (BSOB) Bonding Capillary



For extremely low loop profile of about <50um wire bonding application, the ball stitch on ball (BSOB) is an alternative choice. The process is a two-step one cycle; the first is to form a stud ball bump into the bond pad; and then a reverse bonding (the ball bond is bonded into the lead frame, and stitch on top of the ball bump). The general design rule for the capillary selection for BSOB bonding follows the basic wire bonding fundamentals. 8° face angle is recommended to improve the stitch bondability.

 
 

Figure 1: Pictures showing the bonds made by BSOB bonding.

HOW TO ORDER (pdf)

SPT PART NUMBER RECOMMENDATION (pdf)

BSOB BONDING SEQUENCE (pdf)

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