• About SPT
• SPT Worldwide
• Products & Solutions
  • Chip Bonding Tools
    • Bonding Capillaries
      • CR Copper Wire Bonding
      • AG Silver Alloy Wire Bonding Capillary
      • Long Life Material for Cu Wire Bonding
      • QFN Package Copper & Gold Wire
      • Copper Wire Bonding Capillary
      • SI Stitch Integrator Capillary
      • PI Capillary
      • Infinity 3X Longer Tool Life
      • Specific Package Application
      • Technical Guide
      • Capillary Material
      • Accessories for Wire Bonding
      • Catalog
    • Die Bonding Tools
    • Flip Chip Handling Tools
    • Wedge Bonding Tools
    • Total Bonding Solutions
  • Fine Ceramics Solutions
  • Fine Machining Parts
• Technology & Experience
• Service & Support
• News & Tradeshows
• Publications & Catalogs

News

Click On Image
 

---

 
SPT Coorstek
Joint Customer
Announcement

---

 27th - 29th June

Shanghai New International

Expo Centre
Shanghai, China
Hall N3, Booth 3753