| Top view "Butterfly" Design
||Bottom View "Butterfly" Design|
|The emergence of thinner form factor requirement, the QFN package has primarily become a popular choice because of its size and electrical performance. However, there is a draw back in wire bonding process using QFN lead frames. The polyimide tape adhered underneath the QFN lead fingers introduce a certain level of difficulty in stitch bonding.
SPT’s specially pipelined designed heater block provides maximum vacuum suction while accommodating a larger QFN panel per index- in order to achieve a stable support during stitch bond formation with minimal bouncing effect.
|SPT provides innovative solution for copper wire bonding using heater block design with multi-holes and window clamp- arranged in such a way providing optimum supply of nitrogen forming gas to prevent package oxidation.|
|How To Order:|
| HBXX - User Code - Bonder Model - Package Type (Batch Number)
HBXX: Part Type + Bonding Window Quantity
HB: order both clamp and heater block
HBC: order clamp only
HBH: order heater block only
Example :- HB4X - Semicon - ASM 339 - QFP208L (A123)