Chip Bonding Tools
Bonding Capillaries
Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
Die Bonding Tools
SPT offers a wide range of Die Attachment , Fluid Dispensing and Accessories tools specialized for the assembly of semiconductor dice including :
- Replaceable Tips
- Pick-Up Tools & Die Collets
- Epoxy Dispensing & Stamping Tools
Flip Chip Handling Tools
Due to the increased integration availability of bumping connection,
the Flipchip technology has become a popular assembly technique.
the Flipchip technology has become a popular assembly technique.
Wedge Bonding Tools
Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
Total Bonding Solutions
In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
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