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Chip Bonding Tools

 

Bonding Capillaries

Bonding Capillaries

Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
Die Bonding Tools

Die Bonding Tools

SPT offers a wide range of Die Attachment , Fluid Dispensing  and Accessories tools specialized for the assembly of semiconductor dice including :

  • Replaceable Tips
  • Pick-Up Tools & Die Collets
  • Epoxy Dispensing & Stamping Tools
Flip Chip Handling Tools

Flip Chip Handling Tools

Due to the increased integration availability of bumping connection,
the Flipchip technology has become a popular assembly technique.
Wedge Bonding Tools

Wedge Bonding Tools

Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
Total Bonding Solutions

Total Bonding Solutions

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
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News

 9th - 11th February 2016

Anaheim Convention Center
Anaheim, California

Visit us at Booth 3078
 


15th - 17th March 2016

Shanghai New International
Expo Centre (SNIEC)
Hall N4
Shanghai, China

Visit us at Booth 4816
 


 12th - 14th April 2016

Messe Stuttgart,
Germany
Visit us at 
Hall 3 Booth G11


19th - 22nd April 2016

Forum de l'Arc Moutier,
Switzerland 
Visit us at
Hall 1.2 Booth 251


 26th - 28th April 2016

Messe Nürnberg,
Germany
Visit us at
Hall 7A Booth 508

 

 
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