Logo

Chip Bonding Tools

 

Bonding Capillaries

Bonding Capillaries

Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
Die Bonding Tools

Die Bonding Tools

SPT offers a wide range of Die Attachment , Fluid Dispensing  and Accessories tools specialized for the assembly of semiconductor dice including :

  • Replaceable Tips
  • Pick-Up Tools & Die Collets
  • Epoxy Dispensing & Stamping Tools
Flip Chip Handling Tools

Flip Chip Handling Tools

Due to the increased integration availability of bumping connection,
the Flipchip technology has become a popular assembly technique.
Wedge Bonding Tools

Wedge Bonding Tools

Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
Total Bonding Solutions

Total Bonding Solutions

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
read more...

News

14th - 16th March 2017
 
Shanghai New International
Expo Centre (SNIEC)
Shanghai, China

Booth Number 4816


4th - 6th April 2017

Messe, Stuttgart,
Germany
Visit us at
Hall 1 Booth 1D38
 
 


 16th - 18th May 2017

Exhibition Centre 
Nuremberg Messezentrum
90471 Nuremberg 
Germany
Visit us at
Hall 4A Booth 148
 


20th - 23rd June 2017
Palexpo Geneva
Switzerland
Visit us at
Booth M98 


 
Click here (PDF) to review



Click here (PDF) to review

 
Copyright by SPT-Group http://www.smallprecisiontools.com