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Chip Bonding Tools

 
Bonding Capillaries

Bonding Capillaries

Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
Die Bonding Tools

Die Bonding Tools

SPT offers a wide range of Die Attachment , Fluid Dispensing  and Accessories tools specialized for the assembly of semiconductor dice including :

  • Replaceable Tips
  • Pick-Up Tools & Die Collets
  • Epoxy Dispensing & Stamping Tools
Flip Chip Handling Tools

Flip Chip Handling Tools

Due to the increased integration availability of bumping connection,
the Flipchip technology has become a popular assembly technique.
Wedge Bonding Tools

Wedge Bonding Tools

Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
Total Bonding Solutions

Total Bonding Solutions

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
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News

Introducing
Download the article (PDF)
English
 


23. - 25. April 2014

   Visit us at Booth 217
Marina Bay Sand Expo
Singapore


6.-9. May 2014
Tradeshow Siams
Hall 1.2, Booth B8
Moutier, Switzerland
 


6. - 9. May 2014
SMT Hybrid Packaging
  Hall 7, Booth 317
Nürnberg, Germany


Visit us at Medtec, Stuttgart
  Medtec Stuttgart
3. - 5. June 2014
Booth 5B16, Hall 5
Landesmesse Stuttgart
Stuttgart, Germany

 
Copyright by SPT-Group http://www.smallprecisiontools.com