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Chip Bonding Tools

 

Bonding Capillaries

Bonding Capillaries

Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
Die Bonding Tools

Die Bonding Tools

SPT offers a wide range of Die Attachment , Fluid Dispensing  and Accessories tools specialized for the assembly of semiconductor dice including :

  • Replaceable Tips
  • Pick-Up Tools & Die Collets
  • Epoxy Dispensing & Stamping Tools
Flip Chip Handling Tools

Flip Chip Handling Tools

Due to the increased integration availability of bumping connection,
the Flipchip technology has become a popular assembly technique.
Wedge Bonding Tools

Wedge Bonding Tools

Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
Total Bonding Solutions

Total Bonding Solutions

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
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News


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 5th - 7th May 2020
Exhibition Centre
Nuremberg Messezentrum
90471 Nuremberg
Germany
Visit us at
Hall 4A Booth #146


 5th - 7th May 2020

  Messe, Stuttgart
Germany
Visit us at
Hall 9, Booth B44


 27th - 29th June
Shanghai New International
Expo Centre
Shanghai, China
Hall N3, Booth 3753

 
Copyright by SPT-Group http://www.smallprecisiontools.com