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Chip Bonding Tools

 

Bonding Capillaries

Bonding Capillaries

Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding
Die Bonding Tools

Die Bonding Tools

SPT offers a wide range of Die Attachment , Fluid Dispensing  and Accessories tools specialized for the assembly of semiconductor dice including :

  • Replaceable Tips
  • Pick-Up Tools & Die Collets
  • Epoxy Dispensing & Stamping Tools
Flip Chip Handling Tools

Flip Chip Handling Tools

Due to the increased integration availability of bumping connection,
the Flipchip technology has become a popular assembly technique.
Wedge Bonding Tools

Wedge Bonding Tools

Wedge Bonding Tools for ultrasonic aluminum or gold wire bonding
Total Bonding Solutions

Total Bonding Solutions

In today’s electronics manufacturing environment, reduced product development cycle time and improved product quality are critical factors
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News

10th - 12th February
 
Visit us at Booth 2969
Anaheim Convention Centre
Anaheim California


17th-19th March

  Booth 4820, Hall W4
Shanghai New International
Expo Centre (SNIEC)
2345 Long Yang Rd
Pudong Area 
Shanghai
 


22nd - 24th April  

Visit us at Booth 615
SPICE Arena, Penang
Malaysia

 
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