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Enhanced Stitch Bondability


Enhanced Stitch Bondability

Stitch Integrator (SI) capillary has been developed with the objective to improve the bondability of the stitch bonds through better coupling effect between the bonding tool and the wire during bonding. Through extensive studies and optimizations, the SI capillary has been derived and has proven to enhance the stitch bondability in many field application.

Features :

  • Improved stitch integrator with the substrate with better ultrasonic energy transfer
  • Enhanced coupling effect between the capillary and the wire with better stitch bondability.
     
  • Applicable for 2N wire, insulated wire and poor bondability substrate/lead frame.
  • Higher MTBA with few machine down time and higher production output.
  • APPLICATION DATA
 
As we are aggressively pursuing new technologies to improve the performance of packages and product miniaturization, the current problems associated with wire bonding remains. Bonding issues due to NSOP, NSOL, pad peeling has constantly been a nightmare for wire bond engineers. These issues became more severe with the pressure to reduce the cost of products.

Although it is commonly known that the stitch bond reliability can be improved by increasing the tip diameter and FA/OR optimization of the capillary profile, the limitation lies with fine-pitch and ultra-fine pitch bonding. The restriction with the bond pad pitch limits the flexibility of using a larger tip diameter. The use of a smaller FA helps to improve the stitch bondability but at the expense of lower stitch pull reading and possibly, shorter tool life. Working within these limitations, a new capillary design is today developed by SPT to improve the stitch bondability.

Small Precision Tools (SPT) Stitch Integrator capillary has been developed with the objective to improve the bondability of the stitch bond through better coupling effect between the bonding tool and the wire during bonding. Through extensive studies and optimizations, the Stitch Integrator capillary has been derived and has proven to enhance the stitch bondability as compared to non SI capillary design in many field applications.

Depending on the specific bonding application, the Stitch Integrator capillary can be used together with any existing design feature, such as the DFX (for small ball large wire bonding), Infinity (for extended tool life), etc. Indeed, the Stitch Integrator capillary has proven to be a new revolution for enhanced stitch bondability.




SPT Part Number Recommendation




How To Order (PDF)       Download The Brochure (PDF)


Wire Bonding Application


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