A new revolution in bonding solution for complex devices
The transition from fine-pitch (FP) to ultra fine pitch (UFP) volume production, and the emergence of stacked-die, CSP and ultra low loop bonding has increased the level of difficulties in wire bonding process. In compliance with these new bonding requirements, a new generation and high performance design, known as the PI (Programmed Intelligence) capillary has been developed.
Superior bonding performance with good repeatability and portability for a broad range of complex bonding applications.
Applicable for FP & UFP bonding, ULL bonding, CSP bonding, low-k bonding & stacked-die bonding.
More responsive to the bonding parameters, producing better bond integrity.
The process for low-k device bonding is very sensitive especially for ultra-fine-pitch bonding Low-k工艺技术与超密间距焊线工艺相结合后的Low-k产品对焊线程序参数非常敏感....read 更多more
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