Bonding Capillaries
SPT offers a wide range of bonding capillaries with designs and features optimized for your bonding needs. From standard bonding packages, such as SOIC, TSOP up to complex bonding applications for low-k, stacked die, multi-tier, Cu wire, ultra fine-pitch bonding and many more. SPT capillaries support your widest array of bonding applications and challenges.
CR - The Leading Choice For Copper Wire Bonding
- Enhanced coupling between wire and capillary tip surface
- Excellent long term bonding stability
- Increased durability - higher mechanical resistance
AG Alloy Wire Bonding Capillary
| Applications: |
|
|
|
|
|
|
AZR Long Life Material for Cu Wire Bonding
| Extended Capillary Touchdowns | |
| Improved MTBA | |
| No Change In Bonding Parameters | |
| Consistent Bond Quality |
QFN Package Copper & Gold Wire Bonding Capillary
- Solutions For QFN Package Copper & Gold Wire
Copper Wire Bonding Capillary
- Fine & Large Wire
3X Longer Tool Life
- SPT 'Infinity' capillary material extends the tool life up to 3X its original tool life
Capillary Material
Small Precision Tools wire bonding capillaries are formed out of an ultra-pure 99.99% Al2O3 fine grade ceramic powder......
Bonding Capillary Catalog
Get other Catalogs and Publications from our Chip Bonding Tools
You need Adobe Acrobat Reader to view these files.News
18th - 20th Sept 2019
Taipei Nangang
Exhibition Centre
Taiwan, Taipei
Booth N0367
Taipei Nangang
Exhibition Centre
Taiwan, Taipei
Booth N0367