Bonding Capillaries
SPT offers a wide range of bonding capillaries with designs and features optimized for your bonding needs. From standard bonding packages, such as SOIC, TSOP up to complex bonding applications for low-k, stacked die, multi-tier, Cu wire, ultra fine-pitch bonding and many more. SPT capillaries support your widest array of bonding applications and challenges.
CR - The Leading Choice For Copper Wire Bonding
- Enhanced coupling between wire and capillary tip surface
- Excellent long term bonding stability
- Increased durability - higher mechanical resistance
AG Alloy Wire Bonding Capillary
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AZR Long Life Material for Cu Wire Bonding
| Extended Capillary Touchdowns | |
| Improved MTBA | |
| No Change In Bonding Parameters | |
| Consistent Bond Quality |
QFN Package Copper & Gold Wire Bonding Capillary
- Solutions For QFN Package Copper & Gold Wire
Copper Wire Bonding Capillary
- Fine & Large Wire
3X Longer Tool Life
- SPT 'Infinity' capillary material extends the tool life up to 3X its original tool life
Capillary Material
Small Precision Tools wire bonding capillaries are formed out of an ultra-pure 99.99% Al2O3 fine grade ceramic powder......
Bonding Capillary Catalog
Get other Catalogs and Publications from our Chip Bonding Tools
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7th - 9th May 2019
Exhibition Centre
Nuremberg Messezentrum
90471 Nuremberg
Germany
Visit us at
Hall 4A Booth 146
Exhibition Centre
Nuremberg Messezentrum
90471 Nuremberg
Germany
Visit us at
Hall 4A Booth 146
7th - 9th May 2019
Messe, Stuttgart
Germany
Visit us at
Hall 9, Booth B38
Visit us at
Hall 9, Booth B38