SPT covers a wide range of Chip Bonding Tools, from the time the silicon chip is picked up from the wafer, and placed on the substrate or lead frame up to the period where the actual bonding process takes place. This is where the chips are electrically connected to the outside world using gold, aluminium or copper wire. Our wide ranges of Chip Bonding Tools include:

• Bonding Capillaries for standard and ultra-fine pitch thermosonic gold or copper wire bonding 
• Die Bonding Tools for any die pick and place application
• Flip Chip Handling Tools for die pick and place Flip Chip application
• Wedge Bonding Tools for ultrasonic aluminium or gold wire wedge bonding 
• Single Point-TAB Bonding Tools for Disk Drive application
• Pick up Tools in Ceramic used for Chip Shooters in Surface Mount Technology SMT assembly

专为公差为微米等级的小型复杂及精密组件提供精细陶瓷解决方案 材料 包括氧化铝，氧化锆，氧化锆增韧氧化铝及多晶红宝石。SPT 具备在陶瓷或金属陶瓷材料上做微孔的专业工艺，我们每时每刻随处准备为你服务。
产品：
 

• 医疗工具和植入体
• 牙科应用 
• 工业 和 电子元件 
• 孔径小于15µm的 喷嘴 

SPT’s long years of experience in manufacturing watch jewels has led us to produces customized high precision, wear-resistant parts made of steel and carbides like:

• Cold Forming Tools
• Cutting Blades
• Nozzles
• Wire Guides
• Ultra precision High Speed Milling and Wire EDM with CAD/CAM processing